LFDBGK46RT4S2A
Manufacturer
NXP
Specification
Specification
292 PIN 0.8MM BGA TO 252 0.8MM P
292 PIN 0.8MM BGA TO 252 0.8MM P
Detailed specification
Detailed specification
MPC5746R - Socket Module - BGA
MPC5746R - Socket Module - BGA
Description
Description
The LFDBGK46RT4S2A from NXP USA Inc. is a 292-pin BGA (Ball Grid Array) socket module designed for the MPC5746R microcontroller. It features a 0.8mm pitch, ensuring reliable connections and efficient thermal management. This socket module is ideal for prototyping and testing applications, allowing for easy insertion and removal of the microcontroller without soldering. Its robust design supports high-performance automotive and industrial applications, making it suitable for engineers seeking reliable and efficient solutions in embedded systems.
The LFDBGK46RT4S2A from NXP USA Inc. is a 292-pin BGA (Ball Grid Array) socket module designed for the MPC5746R microcontroller. It features a 0.8mm pitch, ensuring reliable connections and efficient thermal management. This socket module is ideal for prototyping and testing applications, allowing for easy insertion and removal of the microcontroller without soldering. Its robust design supports high-performance automotive and industrial applications, making it suitable for engineers seeking reliable and efficient solutions in embedded systems.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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