LFBGARBS1AO
Manufacturer
NXP
Specification
Specification
SURFACE MOUNT PGA SOCKET FOR 256
SURFACE MOUNT PGA SOCKET FOR 256
Detailed specification
Detailed specification
- Socket Module - PGA
- Socket Module - PGA
Description
Description
The LFBGARBS1AO from NXP USA Inc. is a surface mount PGA socket designed for 256-pin configurations. This socket module facilitates the connection of pin grid array (PGA) devices to printed circuit boards (PCBs), ensuring reliable electrical performance and mechanical stability. It is engineered to support high-density applications, providing ease of assembly and maintenance. The socket's design allows for efficient heat dissipation and minimizes signal integrity issues, making it suitable for various electronic applications in computing and telecommunications.
The LFBGARBS1AO from NXP USA Inc. is a surface mount PGA socket designed for 256-pin configurations. This socket module facilitates the connection of pin grid array (PGA) devices to printed circuit boards (PCBs), ensuring reliable electrical performance and mechanical stability. It is engineered to support high-density applications, providing ease of assembly and maintenance. The socket's design allows for efficient heat dissipation and minimizes signal integrity issues, making it suitable for various electronic applications in computing and telecommunications.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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