OM13495UL
Tillverkare
NXP
Datablad
Datablad
Specifikation
Specifikation
SURFACE MOUNT TO DIP EVALUATION
SURFACE MOUNT TO DIP EVALUATION
Detaljerad specifikation
Detaljerad specifikation
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Beskrivning (eng)
Beskrivning (eng)
The OM13495UL from NXP USA Inc. is a breakout board designed for evaluating I2C-bus surface mount components. It translates various surface mount packages to a leaded format with a 100 mil pin pitch, facilitating easy breadboarding and prototyping. This board supports multiple package types, enhancing flexibility in component evaluation.
The OM13495UL from NXP USA Inc. is a breakout board designed for evaluating I2C-bus surface mount components. It translates various surface mount packages to a leaded format with a 100 mil pin pitch, facilitating easy breadboarding and prototyping. This board supports multiple package types, enhancing flexibility in component evaluation.
Tillgänglighet
Tillgänglighet
Kan beställas hos Westcomp
Kan beställas hos Westcomp
Hämta lagerstatus
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