DILB28P-223TLF
Tillverkare
AMPHENOL
Datablad
Datablad
Specifikation
Specifikation
CONN IC DIP SOCKET 28POS TIN
CONN IC DIP SOCKET 28POS TIN
Detaljerad specifikation
Detaljerad specifikation
28 (2 x 14) Pos DIP, 15.24mm (0.6") Radavstånds Sockel Tenn Genom Hål
28 (2 x 14) Pos DIP, 15.24mm (0.6") Radavstånds Sockel Tenn Genom Hål
Beskrivning (eng)
Beskrivning (eng)
The Amphenol ICC (FCI) DILB28P-223TLF is a 28-position dual in-line package (DIP) socket designed for reliable connections in electronic circuits. This socket features a 0.6" (15.24mm) row spacing, allowing for easy integration into various PCB layouts. Constructed with tin-plated contacts, it ensures excellent conductivity and durability. The through-hole mounting style provides secure placement on printed circuit boards, making it ideal for prototyping and production applications where component interchangeability is required.
The Amphenol ICC (FCI) DILB28P-223TLF is a 28-position dual in-line package (DIP) socket designed for reliable connections in electronic circuits. This socket features a 0.6" (15.24mm) row spacing, allowing for easy integration into various PCB layouts. Constructed with tin-plated contacts, it ensures excellent conductivity and durability. The through-hole mounting style provides secure placement on printed circuit boards, making it ideal for prototyping and production applications where component interchangeability is required.
Tillgänglighet
Tillgänglighet
Kan beställas hos Westcomp
Kan beställas hos Westcomp
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