BGAH310-075E
Tillverkare
OHMITE
Datablad
Datablad
Specifikation
Specifikation
BGA HEATSINK W/TAPE
BGA HEATSINK W/TAPE
Detaljerad specifikation
Detaljerad specifikation
Värmeavledare BGA, CPU, GPU Aluminiumlegering Ytmonterad
Värmeavledare BGA, CPU, GPU Aluminiumlegering Ytmonterad
Beskrivning (eng)
Beskrivning (eng)
The BGAH310-075E from Ohmite is a high-performance heat sink designed specifically for Ball Grid Array (BGA) applications. Constructed from durable aluminum alloy, this top mount heat sink effectively dissipates heat generated by CPUs and GPUs, ensuring optimal thermal management in electronic devices. It features an adhesive tape for easy installation, providing a secure attachment to the component. With its efficient design, the BGAH310-075E enhances the reliability and longevity of sensitive electronic components by maintaining safe operating temperatures.
The BGAH310-075E from Ohmite is a high-performance heat sink designed specifically for Ball Grid Array (BGA) applications. Constructed from durable aluminum alloy, this top mount heat sink effectively dissipates heat generated by CPUs and GPUs, ensuring optimal thermal management in electronic devices. It features an adhesive tape for easy installation, providing a secure attachment to the component. With its efficient design, the BGAH310-075E enhances the reliability and longevity of sensitive electronic components by maintaining safe operating temperatures.
Tillgänglighet
Tillgänglighet
Kan beställas hos Westcomp
Kan beställas hos Westcomp
Hämta lagerstatus
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