AGP30
Tillverkare
CIF
Datablad
Datablad
Detaljerad specifikation
Detaljerad specifikation
CIF - AGP30 - Protoboard, Pad, Epoxy Glass Composite, 1.57mm (0.062in), 160mm (6.299in) x 300mm (11.811in)
CIF - AGP30 - Protoboard, Pad, Epoxy Glass Composite, 1.57mm (0.062in), 160mm (6.299in) x 300mm (11.811in)
Beskrivning (eng)
Beskrivning (eng)
The CIF AGP30 is a high-quality protoboard designed for prototyping and testing electronic circuits. Constructed from durable epoxy glass composite, it features a thickness of 1.57 mm, providing excellent mechanical stability and insulation properties. The board measures 160 mm x 300 mm, offering ample space for component placement and circuit layout. This protoboard is ideal for both professional engineers and hobbyists, facilitating easy assembly and modification of electronic projects while ensuring reliable performance in various applications.
The CIF AGP30 is a high-quality protoboard designed for prototyping and testing electronic circuits. Constructed from durable epoxy glass composite, it features a thickness of 1.57 mm, providing excellent mechanical stability and insulation properties. The board measures 160 mm x 300 mm, offering ample space for component placement and circuit layout. This protoboard is ideal for both professional engineers and hobbyists, facilitating easy assembly and modification of electronic projects while ensuring reliable performance in various applications.
Tillgänglighet
Tillgänglighet
Kan beställas hos Westcomp
Kan beställas hos Westcomp
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