655-53AB
Tillverkare
WAKEFIELD-VETTE
Datablad
Datablad
Specifikation
Specifikation
HEATSINK CPU 40.6MM SQ H=.525"
HEATSINK CPU 40.6MM SQ H=.525"
Detaljerad specifikation
Detaljerad specifikation
Kylfläns Blandad (BGA, LGA, CPU, ASIC...) Aluminium 4,0W @ 40°C Ytmonterad
Kylfläns Blandad (BGA, LGA, CPU, ASIC...) Aluminium 4,0W @ 40°C Ytmonterad
Beskrivning (eng)
Beskrivning (eng)
The Wakefield-Vette 655-53AB is a high-performance aluminum heat sink designed for CPU applications. It features a square base dimension of 40.6 mm (1.600") and a height of 13.3 mm (0.525"). This heat sink is optimized for top mounting and can dissipate up to 4.0W at 40°C, making it suitable for various electronic components including BGA and LGA packages.
The Wakefield-Vette 655-53AB is a high-performance aluminum heat sink designed for CPU applications. It features a square base dimension of 40.6 mm (1.600") and a height of 13.3 mm (0.525"). This heat sink is optimized for top mounting and can dissipate up to 4.0W at 40°C, making it suitable for various electronic components including BGA and LGA packages.
Tillgänglighet
Tillgänglighet
Kan beställas hos Westcomp
Kan beställas hos Westcomp
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