576802B00000G
Tillverkare
BOYD LACONIA, LLC
Datablad
Datablad
Specifikation
Specifikation
HEATSINK TO-220 5W BLK
HEATSINK TO-220 5W BLK
Detaljerad specifikation
Detaljerad specifikation
Kylfläns TO-220, TO-262 Aluminium 1,5W @ 40°C Kortnivå
Kylfläns TO-220, TO-262 Aluminium 1,5W @ 40°C Kortnivå
Beskrivning (eng)
Beskrivning (eng)
The Boyd Laconia 576802B00000G is a high-performance heat sink designed for TO-220 and TO-262 packages, capable of dissipating up to 5W of heat at 40°C. Constructed from durable aluminum, this heat sink ensures efficient thermal management in electronic applications. Its design facilitates optimal airflow and heat dissipation, making it ideal for board-level applications where space is limited. The heat sink's robust construction and effective thermal performance make it suitable for various electronic devices requiring reliable heat management.
The Boyd Laconia 576802B00000G is a high-performance heat sink designed for TO-220 and TO-262 packages, capable of dissipating up to 5W of heat at 40°C. Constructed from durable aluminum, this heat sink ensures efficient thermal management in electronic applications. Its design facilitates optimal airflow and heat dissipation, making it ideal for board-level applications where space is limited. The heat sink's robust construction and effective thermal performance make it suitable for various electronic devices requiring reliable heat management.
Tillgänglighet
Tillgänglighet
Kan beställas hos Westcomp
Kan beställas hos Westcomp
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