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Manufacturers

SPK4-0.006-00-54

Manufacturer

HENKEL

data-sheet
Data sheet
Data sheet
Bergquist Sil-Pad TSP K900 is designed for thermal management applications in industrial and consumer electronics. Its high dielectric strength and thermal conductivity make it ideal for use in power electronics, automotive components, and telecommunications equipment, ensuring efficient heat transfer without the need for thermal grease.
Detailed specification
Detailed specification
Thermal interface products Insulator, 0.006" Thickness, 19.05mm x 12.7mm (0.75" x 0.5"), Sil-Pad TSPK900/K-4, IDH 2192543.
Thermal interface products Insulator, 0.006" Thickness, 19.05mm x 12.7mm (0.75" x 0.5"), Sil-Pad TSPK900/K-4, IDH 2192543.
Description
Description
The Bergquist Sil-Pad TSP K900 is a high-performance thermal interface insulator with a thickness of 0.006" (0.15 mm). It features a Kapton reinforcement carrier, providing excellent thermal conductivity and dielectric strength. Operating temperature range is -60 to 180ºC, making it suitable for demanding thermal management applications.
The Bergquist Sil-Pad TSP K900 is a high-performance thermal interface insulator with a thickness of 0.006" (0.15 mm). It features a Kapton reinforcement carrier, providing excellent thermal conductivity and dielectric strength. Operating temperature range is -60 to 180ºC, making it suitable for demanding thermal management applications.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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Christian BuröKarlskoga031-338 96 73christian.buro@westcomp.se
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Patrick Wiström031-338 96 64patrick.wistrom@westcomp.se
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Petra Målberg031-338 96 79petra.malberg@westcomp.se
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Richard Mattsson031-338 96 84richard.mattsson@westcomp.se
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