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Manufacturers

OM13495UL

Manufacturer

NXP

data-sheet
Data sheet
Data sheet
OM13495UL is utilized in the domain of industrial and consumer electronics, specifically for prototyping and evaluating I2C-bus surface mount devices. It allows engineers to easily interface surface mount components with standard breadboards, making it ideal for development and testing applications.
Specification
Specification
SURFACE MOUNT TO DIP EVALUATION
SURFACE MOUNT TO DIP EVALUATION
Detailed specification
Detailed specification
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Description
Description
The OM13495UL from NXP USA Inc. is a breakout board designed for evaluating I2C-bus surface mount components. It translates various surface mount packages to a leaded format with a 100 mil pin pitch, facilitating easy breadboarding and prototyping. This board supports multiple package types, enhancing flexibility in component evaluation.
The OM13495UL from NXP USA Inc. is a breakout board designed for evaluating I2C-bus surface mount components. It translates various surface mount packages to a leaded format with a 100 mil pin pitch, facilitating easy breadboarding and prototyping. This board supports multiple package types, enhancing flexibility in component evaluation.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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Nicklas Johansson031-338 96 93nicklas.johansson@westcomp.se
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Patrick Wiström031-338 96 64patrick.wistrom@westcomp.se
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Petra Målberg031-338 96 79petra.malberg@westcomp.se
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Richard Mattsson031-338 96 84richard.mattsson@westcomp.se
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