OL23D0AHN/00200Y
Manufacturer
NXP
Specification
Specification
OL23D0AHN - Trimension : Fully C
OL23D0AHN - Trimension : Fully C
Detailed specification
Detailed specification
IC RF. The RDS(on) of the thick film chip resistor is rated for a power of 0.5W (0.02 in). The dimensions of the surface-mounted component are 2mm x 1mm (0.08 in x 0.04 in) with a drum-shaped core that is wire-wound.
IC RF. The RDS(on) of the thick film chip resistor is rated for a power of 0.5W (0.02 in). The dimensions of the surface-mounted component are 2mm x 1mm (0.08 in x 0.04 in) with a drum-shaped core that is wire-wound.
Description
Description
The OL23D0AHN/00200Y from NXP Semiconductors is a highly integrated RF IC designed for advanced applications in wireless communication. This device features Trimension technology, enabling fully C compliance for enhanced performance in various RF environments. It is optimized for low power consumption while maintaining high efficiency, making it suitable for battery-operated devices. The OL23D0AHN is ideal for applications requiring precise RF signal processing, including IoT devices, smart home systems, and industrial automation, ensuring reliable connectivity and robust performance.
The OL23D0AHN/00200Y from NXP Semiconductors is a highly integrated RF IC designed for advanced applications in wireless communication. This device features Trimension technology, enabling fully C compliance for enhanced performance in various RF environments. It is optimized for low power consumption while maintaining high efficiency, making it suitable for battery-operated devices. The OL23D0AHN is ideal for applications requiring precise RF signal processing, including IoT devices, smart home systems, and industrial automation, ensuring reliable connectivity and robust performance.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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