NCJ29D0AHN/0NY
Manufacturer
NXP
Specification
Specification
UWB
UWB
Detailed specification
Detailed specification
IC. The surface-mounted component has a thickness of 1.6 mm (0.063 in) and a width of 3.2 mm (0.126 in). It features a RDS(on) of 10 mΩ and is designed with a tjockfilmsmotstånd. The component can tål en effekt of 1 W and includes a trumformad kärna for improved performance. The winding method is trådlindad.
IC. The surface-mounted component has a thickness of 1.6 mm (0.063 in) and a width of 3.2 mm (0.126 in). It features a RDS(on) of 10 mΩ and is designed with a tjockfilmsmotstånd. The component can tål en effekt of 1 W and includes a trumformad kärna for improved performance. The winding method is trådlindad.
Description
Description
The NCJ29D0AHN/0NY from NXP USA Inc. is an advanced Ultra-Wideband (UWB) integrated circuit (IC) designed for precise location tracking and communication applications. This IC leverages UWB technology to provide high-resolution ranging and positioning capabilities, making it ideal for use in various wireless communication systems. Its compact design and efficient power consumption make it suitable for integration into portable devices, enhancing their functionality in smart home, automotive, and industrial applications.
The NCJ29D0AHN/0NY from NXP USA Inc. is an advanced Ultra-Wideband (UWB) integrated circuit (IC) designed for precise location tracking and communication applications. This IC leverages UWB technology to provide high-resolution ranging and positioning capabilities, making it ideal for use in various wireless communication systems. Its compact design and efficient power consumption make it suitable for integration into portable devices, enhancing their functionality in smart home, automotive, and industrial applications.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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