NCF3340EHN/00340Y
Manufacturer
NXP
Specification
Specification
NCF3340EHN
NCF3340EHN
Detailed specification
Detailed specification
IC. The surface-mounted RDS(on) thick film chip resistor has a size of 1206 (0.126 x 0.063 inches) and can tolerate a power of 1 watt. It features a drum-shaped core and is wire-wound.
IC. The surface-mounted RDS(on) thick film chip resistor has a size of 1206 (0.126 x 0.063 inches) and can tolerate a power of 1 watt. It features a drum-shaped core and is wire-wound.
Description
Description
The NCF3340EHN is an integrated circuit (IC) designed for high-performance applications. It features advanced functionality suitable for various electronic systems, ensuring reliable operation in demanding environments. This IC is optimized for low power consumption while maintaining high efficiency, making it ideal for battery-operated devices. Its compact design allows for easy integration into surface-mounted applications, providing flexibility in circuit design. The NCF3340EHN is a versatile component that meets the needs of modern electronic systems.
The NCF3340EHN is an integrated circuit (IC) designed for high-performance applications. It features advanced functionality suitable for various electronic systems, ensuring reliable operation in demanding environments. This IC is optimized for low power consumption while maintaining high efficiency, making it ideal for battery-operated devices. Its compact design allows for easy integration into surface-mounted applications, providing flexibility in circuit design. The NCF3340EHN is a versatile component that meets the needs of modern electronic systems.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
Contact sales
Contact Richard or one of our other skilled sales representatives. They'll help you find the right service option.C