MBH42.5002-12P/2.6
Manufacturer
KAVLICO
Data sheet
Data sheet
Detailed specification
Detailed specification
MALICO - MBH42.5002-12P/2.6 - Heat Sink, BGA, Black Anodized, 3.4 °C/W, BGA, 42.5 mm (1.77 in), 12 mm (0.47 in), 42.5 mm (1.77 in)
MALICO - MBH42.5002-12P/2.6 - Heat Sink, BGA, Black Anodized, 3.4 °C/W, BGA, 42.5 mm (1.77 in), 12 mm (0.47 in), 42.5 mm (1.77 in)
Description
Description
MALICO MBH42.5002-12P/2.6 is a BGA heat sink designed for efficient thermal management. It features a black anodized finish with a thermal resistance of 3.4 °C/W. The dimensions are 42.5 mm x 42.5 mm with a height of 12 mm and a base thickness of 2.6 mm, suitable for 42.5x42.5 chipsets.
MALICO MBH42.5002-12P/2.6 is a BGA heat sink designed for efficient thermal management. It features a black anodized finish with a thermal resistance of 3.4 °C/W. The dimensions are 42.5 mm x 42.5 mm with a height of 12 mm and a base thickness of 2.6 mm, suitable for 42.5x42.5 chipsets.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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