LFBGARBS2AO
Manufacturer
NXP
Specification
Specification
SURFACE MOUNT PGA SOCKET FOR 252
SURFACE MOUNT PGA SOCKET FOR 252
Detailed specification
Detailed specification
- Socket Module - BGA
- Socket Module - BGA
Description
Description
The LFBGARBS2AO from NXP USA Inc. is a surface mount PGA socket designed specifically for BGA (Ball Grid Array) applications. This socket module facilitates the connection of integrated circuits in a compact form factor, ensuring reliable electrical performance and mechanical stability. It is engineered to accommodate 252 pins, providing a robust interface for high-density packaging. The design optimizes thermal and electrical characteristics, making it suitable for various electronic applications where space and performance are critical.
The LFBGARBS2AO from NXP USA Inc. is a surface mount PGA socket designed specifically for BGA (Ball Grid Array) applications. This socket module facilitates the connection of integrated circuits in a compact form factor, ensuring reliable electrical performance and mechanical stability. It is engineered to accommodate 252 pins, providing a robust interface for high-density packaging. The design optimizes thermal and electrical characteristics, making it suitable for various electronic applications where space and performance are critical.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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