IW611HN/A1IMP
Manufacturer
NXP
Data sheet
Data sheet
Specification
Specification
IC RF 116HVQFN
IC RF 116HVQFN
Detailed specification
Detailed specification
IC RF 116-VFQFN Dual Rows, Exposed Pad
IC RF 116-VFQFN Dual Rows, Exposed Pad
Description
Description
The NXP IW611HN/A1IMP is an integrated circuit (IC) designed for RF applications, featuring a 116-VFQFN package with dual rows and an exposed pad for enhanced thermal performance. This component is optimized for high-frequency operation, making it suitable for various wireless communication systems. Its compact design allows for efficient space utilization on PCBs, while the exposed pad aids in heat dissipation, ensuring reliable performance in demanding environments. This IC is ideal for applications requiring robust RF signal processing.
The NXP IW611HN/A1IMP is an integrated circuit (IC) designed for RF applications, featuring a 116-VFQFN package with dual rows and an exposed pad for enhanced thermal performance. This component is optimized for high-frequency operation, making it suitable for various wireless communication systems. Its compact design allows for efficient space utilization on PCBs, while the exposed pad aids in heat dissipation, ensuring reliable performance in demanding environments. This IC is ideal for applications requiring robust RF signal processing.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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