GX36420-DNT
Manufacturer
RENESAS
Data sheet
Data sheet
Specification
Specification
DIE SALE (PRICE IN GOOD DIE)-WAF
DIE SALE (PRICE IN GOOD DIE)-WAF
Detailed specification
Detailed specification
Telecom IC Die with dimensions of 5 mm (0.20 inches) by 5 mm (0.20 inches) and a thickness of 1 mm (0.04 inches). It features RDS(on) and a tjockfilmsmotstånd. The component is designed to tål en effekt of 1 watt and includes a trumformad kärna. The die is trådlindad and is classified as surface-mounted.
Telecom IC Die with dimensions of 5 mm (0.20 inches) by 5 mm (0.20 inches) and a thickness of 1 mm (0.04 inches). It features RDS(on) and a tjockfilmsmotstånd. The component is designed to tål en effekt of 1 watt and includes a trumformad kärna. The die is trådlindad and is classified as surface-mounted.
Description
Description
The GX36420 is a 64Gbps linear quad TIA chip designed for 400G/600G coherent applications. It integrates four lanes of TIAs for XI, XQ, YI, and YQ channels, along with digital interface circuitry for DC controls. The device features a differential linear gain of 150–5,000Ω, > 30dB dynamic range, and > 40GHz 3dB bandwidth, making it suitable for small-form factor integrated optical modules like CFP2 and CFP4.
The GX36420 is a 64Gbps linear quad TIA chip designed for 400G/600G coherent applications. It integrates four lanes of TIAs for XI, XQ, YI, and YQ channels, along with digital interface circuitry for DC controls. The device features a differential linear gain of 150–5,000Ω, > 30dB dynamic range, and > 40GHz 3dB bandwidth, making it suitable for small-form factor integrated optical modules like CFP2 and CFP4.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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