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ECE1200-I/LD

Manufacturer

MICROCHIP TECHNOLOGY

data-sheet
Data sheet
Data sheet
The ECE1200 is utilized in industrial applications requiring a bridge between modern eSPI interfaces and legacy LPC systems. Typical applications include embedded systems, telecommunications, and consumer electronics where compatibility with older devices is essential while maintaining high-speed communication.
Specification
Specification
IC INTFACE SPECIALIZED ESPI/LPC
IC INTFACE SPECIALIZED ESPI/LPC
Detailed specification
Detailed specification
eSPI to LPC Bridge Interface 40-VQFN (5x5 mm) (0.20x0.20 in)
eSPI to LPC Bridge Interface 40-VQFN (5x5 mm) (0.20x0.20 in)
Description
Description
The ECE1200 is an eSPI to LPC bridge interface IC designed for seamless communication between modern eSPI-configured Intel chipsets and legacy LPC systems. It operates at 1.8V and 3.3V, supporting up to 50 MHz eSPI and LPC clock frequencies. The device features low standby current, ACPI 6.1 compliance, and supports various LPC-based SIO and EC devices. It is housed in a 40-pin VQFN package and operates within an industrial temperature range of -40°C to +85°C.
The ECE1200 is an eSPI to LPC bridge interface IC designed for seamless communication between modern eSPI-configured Intel chipsets and legacy LPC systems. It operates at 1.8V and 3.3V, supporting up to 50 MHz eSPI and LPC clock frequencies. The device features low standby current, ACPI 6.1 compliance, and supports various LPC-based SIO and EC devices. It is housed in a 40-pin VQFN package and operates within an industrial temperature range of -40°C to +85°C.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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