DILB28P-223TLF
Manufacturer
AMPHENOL
Data sheet
Data sheet
Specification
Specification
CONN IC DIP SOCKET 28POS TIN
CONN IC DIP SOCKET 28POS TIN
Detailed specification
Detailed specification
28 (2 x 14) Pos DIP, 15.24mm (0.6") Row Spacing Socket Tin Through Hole
28 (2 x 14) Pos DIP, 15.24mm (0.6") Row Spacing Socket Tin Through Hole
Description
Description
The Amphenol ICC (FCI) DILB28P-223TLF is a 28-position dual in-line package (DIP) socket designed for reliable connections in electronic circuits. This socket features a 0.6" (15.24mm) row spacing, allowing for easy integration into various PCB layouts. Constructed with tin-plated contacts, it ensures excellent conductivity and durability. The through-hole mounting style provides secure placement on printed circuit boards, making it ideal for prototyping and production applications where component interchangeability is required.
The Amphenol ICC (FCI) DILB28P-223TLF is a 28-position dual in-line package (DIP) socket designed for reliable connections in electronic circuits. This socket features a 0.6" (15.24mm) row spacing, allowing for easy integration into various PCB layouts. Constructed with tin-plated contacts, it ensures excellent conductivity and durability. The through-hole mounting style provides secure placement on printed circuit boards, making it ideal for prototyping and production applications where component interchangeability is required.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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