CMBA054949
Manufacturer
KAVLICO
Data sheet
Data sheet
Detailed specification
Detailed specification
MALICO - CMBA054949 - Heat Sink, For North Bridge, 4.2 °C/W, BGA, 37.5 mm (1.48 in), 33 mm (1.30 in), 37.5 mm (1.48 in)
MALICO - CMBA054949 - Heat Sink, For North Bridge, 4.2 °C/W, BGA, 37.5 mm (1.48 in), 33 mm (1.30 in), 37.5 mm (1.48 in)
Description
Description
The MALICO CMBA054949 is a BGA heat sink designed for North Bridge chipsets, featuring a thermal resistance of 4.2 °C/W. It has a footprint of 37.5 mm x 37.5 mm and is available in various heights (12 mm to 33 mm). Constructed from CU1100 with antioxidant treatment, it includes plastic push pins and a thermal pad for optimal performance.
The MALICO CMBA054949 is a BGA heat sink designed for North Bridge chipsets, featuring a thermal resistance of 4.2 °C/W. It has a footprint of 37.5 mm x 37.5 mm and is available in various heights (12 mm to 33 mm). Constructed from CU1100 with antioxidant treatment, it includes plastic push pins and a thermal pad for optimal performance.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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