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Manufacturers

BGAH375-125E

Manufacturer

OHMITE

data-sheet
Data sheet
Data sheet
BGAH375-125E is utilized in thermal management applications for CPUs and GPUs in electronic devices. Typical applications include high-performance computing, gaming consoles, and graphics processing units where effective heat dissipation is critical for performance and reliability.
Specification
Specification
BGA HEATSINK W/TAPE
BGA HEATSINK W/TAPE
Detailed specification
Detailed specification
Heat Sink BGA, CPU, GPU Aluminum Alloy Top Mount
Heat Sink BGA, CPU, GPU Aluminum Alloy Top Mount
Description
Description
The BGAH375-125E from Ohmite is a high-performance heat sink designed specifically for Ball Grid Array (BGA) applications. Constructed from durable aluminum alloy, this top mount heat sink effectively dissipates heat generated by CPUs and GPUs, ensuring optimal thermal management in electronic devices. It features an adhesive tape for easy installation, providing a secure attachment to the component. With its efficient design, the BGAH375-125E enhances the reliability and longevity of critical electronic systems by maintaining safe operating temperatures.
The BGAH375-125E from Ohmite is a high-performance heat sink designed specifically for Ball Grid Array (BGA) applications. Constructed from durable aluminum alloy, this top mount heat sink effectively dissipates heat generated by CPUs and GPUs, ensuring optimal thermal management in electronic devices. It features an adhesive tape for easy installation, providing a secure attachment to the component. With its efficient design, the BGAH375-125E enhances the reliability and longevity of critical electronic systems by maintaining safe operating temperatures.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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Patrick Wiström031-338 96 64patrick.wistrom@westcomp.se
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Petra Målberg031-338 96 79petra.malberg@westcomp.se
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Richard Mattsson031-338 96 84richard.mattsson@westcomp.se
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