AGP30
Manufacturer
CIF
Data sheet
Data sheet
Detailed specification
Detailed specification
CIF - AGP30 - Protoboard, Pad, Epoxy Glass Composite, 1.57mm (0.062in), 160mm (6.299in) x 300mm (11.811in)
CIF - AGP30 - Protoboard, Pad, Epoxy Glass Composite, 1.57mm (0.062in), 160mm (6.299in) x 300mm (11.811in)
Description
Description
The CIF AGP30 is a high-quality protoboard designed for prototyping and testing electronic circuits. Constructed from durable epoxy glass composite, it features a thickness of 1.57 mm, providing excellent mechanical stability and insulation properties. The board measures 160 mm x 300 mm, offering ample space for component placement and circuit layout. This protoboard is ideal for both professional engineers and hobbyists, facilitating easy assembly and modification of electronic projects while ensuring reliable performance in various applications.
The CIF AGP30 is a high-quality protoboard designed for prototyping and testing electronic circuits. Constructed from durable epoxy glass composite, it features a thickness of 1.57 mm, providing excellent mechanical stability and insulation properties. The board measures 160 mm x 300 mm, offering ample space for component placement and circuit layout. This protoboard is ideal for both professional engineers and hobbyists, facilitating easy assembly and modification of electronic projects while ensuring reliable performance in various applications.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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