A2F12M12W2-F1
Manufacturer
ST MICROELECTRONICS
Data sheet
Data sheet
Specification
Specification
ACEPACK 2 POWER MODULE, FOURPACK
ACEPACK 2 POWER MODULE, FOURPACK
Detailed specification
Detailed specification
IGBT Module Full Bridge Chassis Mount ACEPACK™ 2
IGBT Module Full Bridge Chassis Mount ACEPACK™ 2
Description
Description
The A2F12M12W2-F1 is an ACEPACK 2 power module featuring a fourpack topology with integrated SiC Power MOSFET technology. It offers a typical RDS(on) of 13 mΩ per switch, a maximum drain-source voltage of 1200 V, and an insulation voltage of 2.5 kVrms. The module includes an NTC temperature sensor and is designed for high thermal performance, making it suitable for demanding applications.
The A2F12M12W2-F1 is an ACEPACK 2 power module featuring a fourpack topology with integrated SiC Power MOSFET technology. It offers a typical RDS(on) of 13 mΩ per switch, a maximum drain-source voltage of 1200 V, and an insulation voltage of 2.5 kVrms. The module includes an NTC temperature sensor and is designed for high thermal performance, making it suitable for demanding applications.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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