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A15896-06

Manufacturer

LAIRD TECHNOLOGIES - THERMAL MATERIALS

data-sheet
Data sheet
Data sheet
Tflex™ 700 is designed for use in industrial applications requiring efficient thermal management. Its high thermal performance and compliance make it suitable for electronic devices, automotive components, and telecommunications equipment, ensuring optimal heat dissipation and reliability.
Specification
Specification
THERM PAD 228.6MMX228.6MM GRAY
THERM PAD 228.6MMX228.6MM GRAY
Detailed specification
Detailed specification
Thermal Pad Gray 228.60mm x 228.60mm (9.00in x 9.00in) Square Tacky - Both Sides
Thermal Pad Gray 228.60mm x 228.60mm (9.00in x 9.00in) Square Tacky - Both Sides
Description
Description
Tflex™ 700 is a soft gap filler thermal interface material with a thermal conductivity of 5.0 W/mK. It features a naturally tacky surface for easy assembly, conforms to component topography, and operates effectively from -40°C to 200°C. The product is UL 94V0 rated and available in thicknesses from 0.5mm to 5.0mm.
Tflex™ 700 is a soft gap filler thermal interface material with a thermal conductivity of 5.0 W/mK. It features a naturally tacky surface for easy assembly, conforms to component topography, and operates effectively from -40°C to 200°C. The product is UL 94V0 rated and available in thicknesses from 0.5mm to 5.0mm.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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