655-53AB
Manufacturer
WAKEFIELD-VETTE
Data sheet
Data sheet
Specification
Specification
HEATSINK CPU 40.6MM SQ H=.525"
HEATSINK CPU 40.6MM SQ H=.525"
Detailed specification
Detailed specification
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.0W @ 40°C Top Mount
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.0W @ 40°C Top Mount
Description
Description
The Wakefield-Vette 655-53AB is a high-performance aluminum heat sink designed for CPU applications. It features a square base dimension of 40.6 mm (1.600") and a height of 13.3 mm (0.525"). This heat sink is optimized for top mounting and can dissipate up to 4.0W at 40°C, making it suitable for various electronic components including BGA and LGA packages.
The Wakefield-Vette 655-53AB is a high-performance aluminum heat sink designed for CPU applications. It features a square base dimension of 40.6 mm (1.600") and a height of 13.3 mm (0.525"). This heat sink is optimized for top mounting and can dissipate up to 4.0W at 40°C, making it suitable for various electronic components including BGA and LGA packages.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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