576802B00000G
Manufacturer
BOYD LACONIA, LLC
Data sheet
Data sheet
Specification
Specification
HEATSINK TO-220 5W BLK
HEATSINK TO-220 5W BLK
Detailed specification
Detailed specification
Heat Sink TO-220, TO-262 Aluminum 1.5W @ 40°C Board Level
Heat Sink TO-220, TO-262 Aluminum 1.5W @ 40°C Board Level
Description
Description
The Boyd Laconia 576802B00000G is a high-performance heat sink designed for TO-220 and TO-262 packages, capable of dissipating up to 5W of heat at 40°C. Constructed from durable aluminum, this heat sink ensures efficient thermal management in electronic applications. Its design facilitates optimal airflow and heat dissipation, making it ideal for board-level applications where space is limited. The heat sink's robust construction and effective thermal performance make it suitable for various electronic devices requiring reliable heat management.
The Boyd Laconia 576802B00000G is a high-performance heat sink designed for TO-220 and TO-262 packages, capable of dissipating up to 5W of heat at 40°C. Constructed from durable aluminum, this heat sink ensures efficient thermal management in electronic applications. Its design facilitates optimal airflow and heat dissipation, making it ideal for board-level applications where space is limited. The heat sink's robust construction and effective thermal performance make it suitable for various electronic devices requiring reliable heat management.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
Check stock
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