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40113005

Manufacturer

WÜRTH

data-sheet
Data sheet
Data sheet
WE-TGF Thermal Gap Filler Pad is designed for use in general electronic equipment, particularly in applications requiring effective thermal management. It is suitable for consumer electronics, telecommunications, and industrial applications where heat dissipation is critical.
Specification
Specification
THERM PAD 100MMX100MM BLUE
THERM PAD 100MMX100MM BLUE
Detailed specification
Detailed specification
Thermal Pad Blue 100.00mm x 100.00mm Square (3.94in x 3.94in)
Thermal Pad Blue 100.00mm x 100.00mm Square (3.94in x 3.94in)
Description
Description
The WE-TGF Thermal Gap Filler Pad (40113005) is a blue silicone-based thermal pad designed for efficient heat transfer in electronic applications. It measures 100.00 mm x 100.00 mm and features a thermal conductivity of 3 W/(m*K), dielectric strength of 8 kV/mm, and operates within a temperature range of -50 to +180 °C. The pad is reinforced with fiberglass mesh and is compliant with RoHS and REACh regulations.
The WE-TGF Thermal Gap Filler Pad (40113005) is a blue silicone-based thermal pad designed for efficient heat transfer in electronic applications. It measures 100.00 mm x 100.00 mm and features a thermal conductivity of 3 W/(m*K), dielectric strength of 8 kV/mm, and operates within a temperature range of -50 to +180 °C. The pad is reinforced with fiberglass mesh and is compliant with RoHS and REACh regulations.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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