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40013020

Manufacturer

WÜRTH

data-sheet
Data sheet
Data sheet
WE-TGF Thermal Gap Filler Pad is designed for use in general electronic equipment, particularly in applications requiring effective thermal management. It is suitable for consumer electronics, telecommunications, and industrial applications where heat dissipation is critical.
Specification
Specification
THERM PAD 100MMX100MM BLUE
THERM PAD 100MMX100MM BLUE
Detailed specification
Detailed specification
Thermal Pad Blue 100.00mm x 100.00mm Square (3.94in x 3.94in)
Thermal Pad Blue 100.00mm x 100.00mm Square (3.94in x 3.94in)
Description
Description
The WE-TGF Thermal Gap Filler Pad (MPN: 40013020) is a blue silicone-based thermal pad designed for efficient heat transfer in electronic applications. It measures 100.00 mm x 100.00 mm with a thickness of 0.15 mm ±0.06 mm. The pad exhibits a thermal conductivity of 3 W/(m*K) and a dielectric strength of 8 kV/mm. Operating temperature ranges from -50 °C to +180 °C, making it suitable for various electronic equipment.
The WE-TGF Thermal Gap Filler Pad (MPN: 40013020) is a blue silicone-based thermal pad designed for efficient heat transfer in electronic applications. It measures 100.00 mm x 100.00 mm with a thickness of 0.15 mm ±0.06 mm. The pad exhibits a thermal conductivity of 3 W/(m*K) and a dielectric strength of 8 kV/mm. Operating temperature ranges from -50 °C to +180 °C, making it suitable for various electronic equipment.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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