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40004040

Manufacturer

WÜRTH

data-sheet
Data sheet
Data sheet
WE-TGF Thermal Gap Filler Pad is designed for use in general electronic equipment, particularly in applications requiring effective thermal management. It is suitable for consumer electronics, telecommunications, and industrial applications where heat dissipation is critical.
Specification
Specification
THERM PAD 400X200MM PURP
THERM PAD 400X200MM PURP
Detailed specification
Detailed specification
Thermal Pad Purple 400.00mm x 200.00mm (15.75in x 7.87in) Rectangular
Thermal Pad Purple 400.00mm x 200.00mm (15.75in x 7.87in) Rectangular
Description
Description
The WE-TGF Thermal Gap Filler Pad from Würth Elektronik is a purple silicone-based thermal pad designed for efficient heat transfer in electronic applications. It measures 400.00 mm x 200.00 mm with a thermal conductivity of 4 W/(m*K) and a dielectric strength of 8 kV/mm. The pad operates within a temperature range of -50 to +180 °C and features a hardness of 35 Shore C. It is suitable for general electronic equipment but not for high-reliability applications.
The WE-TGF Thermal Gap Filler Pad from Würth Elektronik is a purple silicone-based thermal pad designed for efficient heat transfer in electronic applications. It measures 400.00 mm x 200.00 mm with a thermal conductivity of 4 W/(m*K) and a dielectric strength of 8 kV/mm. The pad operates within a temperature range of -50 to +180 °C and features a hardness of 35 Shore C. It is suitable for general electronic equipment but not for high-reliability applications.
Availability
Availability
Can be ordered from Westcomp
Can be ordered from Westcomp
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